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Vertical 3D Memory Technologies Hardcover
by Betty Prince. Edition Date:: 10/06/2014

The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories,  terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of  Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via  connections now and remote links later.

About the Author

Dr Betty Prince has over 30 years’ experience in the semiconductor industry having worked with Texas Instruments, N.V. Philips, Motorola, R.C.A., and Fairchild a

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